a.RoHS compliant & Halogen Free
b.All high-density boards
c.0805 Dimension,Surface mountable,Solid state,Faster time to trip than standard SMD devices.Lower resistance than standard SMD devices.
e.Maximum Voltage: 6V -30V
f.Temperature Range: -45°C to +85°C
Terminal Pad material: Pure Tin
Soldering Characteristics: Meets EIA specification RS 186-9E, ANSI/J-std-002 Category 3
UL Recognized 0.05-1.1A
IH=Hold current-maximum current at which the device will not trip at 23℃ still air.
IT=Trip current-minimum current at which the device will always trip at 23℃ still air.
V MAX=Maximum voltage device can withstand without damage at it rated current.(I MAX)
I MAX= Maximum fault current device can withstand without damage at rated voltage (V MAX).
Pd=Typical power dissipated-type amount of power dissipated by the device when in the tripped state in 23℃ still air environment.
RMIN=Minimum device resistance at 23℃ prior to tripping.
R1MAX=Maximum device resistance at 23℃ measured 1 hour after tripping or reflow soldering of 260℃ for 20 seconds.
Termination pad characteristics
Termination pad materials : Pure Tin