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产品描述
Feature
All high-density boards
100% lead-free RoHS and REACH compliant
Low internal resistance
Operating temperature range: -40°C to +125°C
Small portable devices,mobile phone,PDA etc.
Digital products,Game equipment,LCD/LED monitors & modules(Backlight inverter),Battery package,Auto Electronics.
Approval
UL Recognized 100mA-8A
Interrupting Rating
0.1A~8A : 50 amperes at 125V AC/DC
0.1A~8A : 100 amperes at 65V AC/DC
Soldering Method
*Reflow Soldering : 260°C, 30Sec. max.
*Wave Soldering : 260°C, 10Sec. max.
*Hand Soldering : 350°C, 1Sec. max.
Material
Construction Body Material: Ceramic
Termination Material: Silver(Ag),Nickel(Ni),Tin(Sn)
Fuse Element: Silver(Ag)
Termination Material: Silver(Ag),Nickel(Ni),Tin(Sn)
Fuse Element: Silver(Ag)
Environmental Specification
Thermal Shock:10cycles of -40°C to +125°C
R<10%

Humidity:85±3°C; 85±5%RH;1000Hrs No mechanical damages
Vibration:With 10-55-10Hz/min;1.5mm;XYZdirection/2hrs No mechanical damages
Insulation Resistance:10,000 ohms or more after opening
Resistance to soldering heat:260±5°C; 10±1 Sec No mechanical damages
Solder ability:245±5°C; 2±0.5 Sec 95% coverage minimum
Terminal strength:10N;10Sec No mechanical damages
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