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CH1206
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产品描述
Feature
All high-density boards
100% lead-free RoHS and REACH compliant
Low internal resistance
Low internal resistance
Operating temperature range: -40°C to +125°C
Small portable devices,mobile phone,PDA etc.
Digital products,Game equipment,LCD/LED monitors & modules(Backlight inverter),Battery package,Auto Electronics.
Digital products,Game equipment,LCD/LED monitors & modules(Backlight inverter),Battery package,Auto Electronics.
Approval
UL Recognized 10A~15A
Interrupting Rating
10A~15A : 50 amperes at 32V DC(UL)
10A~30A:150 amperes at 32V DC
Soldering Method
*Refow Soldering :260°C, 10Sec. max.
*Wave Soldering : 260°C, 10Sec. max. 265±5°C, 10Sec. max three times.
*Hand Soldering : 350°C, 3Sec. max.
Material
Construction Body Material: Ceramic
Termination Material:Tin(Sn)
Fuse Element: Silver alloy
Termination Material:Tin(Sn)
Fuse Element: Silver alloy
Environmental Specification
Thermal Shock:-65ºC to +125ºC, 100 cycles,no mechanical damage, 10% DCR change max.
Vibration:5 – 3000 Hz, 0.4 inch double amplitude or 30 G peak,10% DCR change max.
Resistance to soldering heat:260ºC, 60 seconds,10% DCR change max.
Solder ability:255ºC, 5 seconds, 95% coverage min.
Terminal strength:1206 – 1.5 kg 30 second hanging, no damage
Salt Spray:5% salt solution, 48 hour exposure
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